Nintendo potrebbe essere già a lavoro su ben 2 nuove console

Dopo il vero e proprio flop con Wii U, secondo quanto riportato da Gaminrealm, Nintendo sarebbe già al lavoro per rimediare ai propri errori con lo sviluppo di 2 nuove console.

La prima dovrebbe essere un device portable e dovrebbe essere chiamata Fusion DS, mentre la seconda dovrebbe essere una console casalinga denominata Fusion Terminal.

Gaminrealm riporta addirittura le caratteristiche hardware di queste due nuove console che noi vi riproponiamo di seguito, anche se consigliamo di prendere tutto ciò con le pinze:

FUSION DS:

• CPU: ARMv8-A Cortex-A53
• GPU: Custom Adreno 420-based AMD GPU
• COM MEMORY: 3 GB LPDDR3 (2 GB Games, 1 GB OS)
• 2 130 mm DVGA (960 x 640) Capacitive Touchscreen
• Slide Out Design with Custom Swivel Tilt Hinge
• Upper Screen made of Gorilla Glass, Comes with Magnetic Cover
• Low End Vibration for Gameplay and App Alerts
• 2 Motorized Circle Pads for Haptic Feedback
• Thumbprint Security Scanner with Pulse Sensing Feedback
• 2 1mp Stereoptic Cameras
• Multi-Array Microphone
• A, B, X, Y, D-Pad, L, R, 1, 2 Buttons
• 3 Axis Tuning Fork Gyroscope, 3 Axis Accelerometer, Magnetometer
• NFC Reader
• 3G Chip with GPS Location
• Bluetooth v4.0 BLE Command Node used to Interface with Bluetooth Devices such as Cell Phones, Tablets
• 16 Gigabytes of Internal Flash Storage (Possible Future Unit With 32 Gigbytes)
• Nintendo 3DS Cart Slot
• SDHC “Holographic Enhanced” Card Slot up to 128 Gigabyte Limit
• Mini USB I/O
• 3300 mAh Li-Ion battery

FUSION TERMINAL:

• GPU: Custom Radeon HD RX 200 GPU CODENAME LADY (2816 shaders @ 960 MHz, 4.60 TFLOP/s, Fillrates: 60.6 Gpixel/s, 170 Gtexel/s)
• CPU: IBM 64-Bit Custom POWER 8-Based IBM 8-Core Processor CODENAME JUMPMAN (2.2 GHz, Shared 6 MB L4 cache)
• Co-CPU: IBM PowerPC 750-based 1.24 GHz Tri-Core Co-Processor CODENAME HAMMER MEMORY: 4 Gigabytes of Unified DDR4 SDRAM CODENAME KONG, 2 GB DDR3 RAM @ 1600 MHz (12.8 GB/s) On Die CODENAMED BARREL
• 802.11 b/g/n Wireless
• Bluetooth v4.0 BLE
• 2 USB 3.0
• 1 Coaxial Cable Input
• 1 CableCARD Slot
• 4 Custom Stream-Interface Nodes up to 4 Wii U GamePads or 4 DSc
• Versions with Disk Drive play Wii U Optical Disk (4 Layers Maximum), FUSION Holographic Versatile Disc (HVD) and Nintendo 3DS Card Slot.
• 1 HDMI 2.0 1080p/4K Port – Dolby TrueHD 5.1 or 7.1 Surround Sound
• Inductive Charging Surface for up to 4 FUSION DS or IC-Wii Remote Plus Controllers
• Two versions: Disk Slot Version with 60 Gigs of Internal Flash Storage and Diskless Version with 300 Gigs of Internal Flash Storage.